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product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 tsz22111 ? 14 ? 001 www. r ohm.com figure 1. typical application circuit 2.7v to 5.5v input ,3a integrated mosfet single synchronous buck dc/dc converter BD9B331GWZ general description rohm?s high efficiency switching regulator, BD9B331GWZ, is a step-down converter designed to produce a low voltage output of 0.6v~3.3v from a 2.7v~5.5v power supply line. it offers high efficiency in all load ranges by automatic pfm/pwm adjustment. it employs an on time control system to provide faster transient response to sudden change in load. features ? fast transient response wi th on time control system. ? high efficiency for all load range with synchronous rectifier (nch/nch fet) and adaptive pfm/pwm system. ? adjustable soft-start function. ? thermal and uvlo protection. ? short-circuit current protection with pulse count ? shutdown function. applications power supply for lsi including soc, dsp, micro computer and asic ? laptop pc / tablet pc / server ? lcd tv, storage devices (hdd / ssd) ? printer ? amusement ? secondary power supply key specifications ? input voltage range: 2.7v to 5.5v ? output voltage range: 0.6v to pv cc 0.8v ? output current: 3.0a (max) ? switching frequency: 1.3mhz(typ) ? high side fet on resistance: 23m ? (typ) ? low side fet on resistance: 23m ? (typ) ? standby current: 0a (typ) ? operating temperature range: -40c to +85c package(s) w(typ) x d(typ) x h(max) ucsp30l1: 1.98mm x 1.80mm x 0.33mm . typical application circuit(s) ucsp30l1 sw a gnd pvcc a vcc en l c out v out c bst fb ss bst pgd pgd v in BD9B331GWZ c in c ss en res pgnd
datasheet d a t a s h e e t 2/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ figure 2. pin configuration pin configuration (bottom view) pin description(s) pin no symbol function pin no symbol function a1 fb output feedback pin c1 en enable pin high active a2 agnd ground pin c2 ss soft start capacitor connection pin a3 pgnd power ground pin c3 sw switch pin a4 pgnd power ground pin c4 sw switch pin b1 pgd power good open drain pin d1 avcc power supply input pin b2 res reserved pin (connect to ground) d2 bst bootstrap pin b3 sw switch pin d3 pvcc power supply input pin b4 sw switch pin d4 pvcc power supply input pin block diagram(s) figure 3. block diagram control logic + drv ref tsd uvlo on time ilim on time modulation 0.8ref fb pgd pgnd sw pvcc en v out 1uh avcc agnd bst amp error amp over shoot reduction res + 22uf ss 0.85ref 22uf 0.1uf 100pf 1000pf d c b a 1234
datasheet d a t a s h e e t 3/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ absolute maximum ratings (ta = 25c) parameter symbol rating unit avcc / pvcc voltage av cc / pv cc -0.3 to +7 (note 1) v en voltage v en -0.3 to +7 (note 1) v bst voltage v bst -0.3 to +13 v bst_sw voltage v bst - sw -0.3 to +7 v sw voltage vsw -0.3 to pvcc+0.3 v ss/fb/pgd/ voltage v ss / v fb v pgd -0.3 to +7 v power dissipation pd 0.81 (note 2) w operating temperature range topr -40 to +85 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax +150 c (note 1) pd,and tj=150c should not be exceeded. (note 2) derate by 6.5mw/c when operating above ta=25c. when mounted on a board 63mm 55mm 1.6mm glass-epoxy board, 9 layer.(refer to page.16 ) recommended operating ratings (ta=-40 to 85 ) parameter symbol rating unit min. typ. max. power supply voltage av cc 2.7 5.0 5.5 v pv cc 2.7 5.0 5.5 v en voltage v en 0 avcc 5.5 v output voltage range v out 0.6 - pv cc 0.8 v sw average output current i sw - - 3 (note 3) a (note 3) pd, aso should not be exceeded
datasheet d a t a s h e e t 4/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ electrical characteristics (unless otherwise specified av cc =pv cc =5v, en=av cc ta=25c) parameter symbol limits unit conditions min. typ. max. supply avcc and pvcc voltage range v in 2.7 - 5.5 v standby current i stb - - 3 a en=gnd active current i cc - 150 200 a uvlo detection voltage v uvlo th 2.38 2.50 2.62 v av cc falling uvlo hysteresis v uvlo hys 40 50 60 mv enable en low voltage v enl gnd - 0.5 v standby mode en high voltage v enh 1.5 - avcc v active mode en input current i en - 3 6 a v en =5v power good pg threshold voltage v pgth -20% -15% -10% v v fb -15% (typ) pg hysteresis voltage v pghys -25% -20% -15% v v fb -20% (typ) pg detect delay time p delay 6 15 25 s open drain output resistance r pg 50 100 200 ? v fb datasheet d a t a s h e e t 5/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ typical performance curves figure 4. pfm operation, load 0ma figure 5. pfm operation, load 100ma figure 6. pwm operation, load 500ma figure 7. pwm operation, load 1000ma v in =3.3v v out =0.9v l =1h 0.5s/div 0.5s/div sw pin 2v/div v out 50mv/div i inductor 0.3a/div v in =3.3v v out =0.9v l =1h 0.5s/div sw pin 2v/div v out 50mv/div i inductor 0.3a/div sw pin 2v/div v out 50mv/div i inductor 0.3a/div v in =3.3v v out =0.9v l =1h sw pin 2v/div v out 50mv/div i inductor 0.3a/div 0.5s/div v in =3.3v v out =0.9v l =1h
datasheet d a t a s h e e t 6/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ typical performance curves - continued figure 8. load rise response v out 50mv/div i out 0.5a/div v in =3.3v v out =0.9v c out =22f l =1uh 1ma 1a/sec figure 9. load fall response figure 10. start up (with v in uvlo) v in 3v/div v en pin 3v/div v out 0.5v/div 500s/div v in =3.3v en= v in short v out =0.9v/r out =1 ? l =1h figure 11. shutdown (with v in uvlo) 500s/div 5s/div v in =3.3v v out =0.9v c out =22f l =1uh 1ma 1a/sec 5s/div v out 50mv/div i out 0.5a/div v in =3.3v en= v in short v out =0.9v/ r out =1 ? l =1h v in 3v/div v en pin 3v/div v out 0.5v/div
datasheet d a t a s h e e t 7/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ typical performance curves - continued 500s/div v in =3.3v v out =0.9v/r out =1 ? l =1h figure 12. start up (with en) figure 13. shutdown (with en) v in 3v/div sw pin 3v/div v out 0.5v/div 500s/div figure 14. v in variation 2.9v 5.5v figure 15. v in variation 5.5v 2.9v v in =3.3v v out =0.9v/1.0a l =1h v in 3v/div v en 3v/div v out 0.5v/div v in =3.3v v out =0.9v/ r out =1 ? l =1h v in 3v/div v en 3v/div v out 0.5v/div v in =3.3v v out =0.9v/1.0a l =1h 500s/div 500s/div v in 3v/div sw pin 3v/div v out 0.5v/div
datasheet d a t a s h e e t 8/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ typical performance curves - continued v en 3v/div v out 0.5v/div pgd pin 3v/div figure 16. power good (start up) 500s/div v in =3.3v v out =1.0v/10ma l =1h p gd =10k ? pull up standby soft start normal operate figure 17. power good (shutdown) 500s/div standby normal operate figure 18. output ground fault 200s/div v out 0.5v/div v in =3.3v v out =0.9v l =1h sw pin 3v/div i out 3a/div v in =3.3v v out =1.0v/10ma l =1h p gd =10k ? pull up v en 3v/div v out 0.5v/div pgd pin 3v/div
datasheet d a t a s h e e t 9/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ typical performance curves - continued 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 output current : i out [m a] efficiency : [%] 20 22 24 26 28 30 32 34 36 38 40 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 input voltage v in [v] resistance : r on [m ? ] 0.0 0.3 0.6 0.9 1.2 0.6 0.8 1.0 1.2 1.4 input voltage v en [v] output voltage v out [v] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 2.4 2.5 2.6 2.7 input voltage v in [v] output voltage v out [v] figure 21. efficiency figure 22. power mos on resistor figure 19. v en start up figure 20. v in start up v in =3.3v v out =0.9v v out =0.9v v in =3.3v v out =0.9v l =252010f_1r0m (toko) high side mosfet low side mosfet
datasheet d a t a s h e e t 10/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ typical performance curves - continued -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 input voltage v in [v] output voltage deviation : S v out [%] -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0 1000 2000 3000 output current : i out [m a] output voltage deviation : S v out [%] 80 85 90 95 100 105 110 3.0 3.5 4.0 4.5 5.0 5.5 6.0 in pu t vol tage : v in [v] resistance : r on [m ? ] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.40 0.45 0.50 0.55 0.60 feed back voltage : v fb [v] power good voltage : pgd [v] figure 23. powe r good mos on resisto r figure 24. power good voltage/hysteresis v in =3.3v v out =0.9v l =1h v out =0.9v/1a l =1h figure 25. output variation (load regulation) figure 26. output variation (line regulation)
datasheet d a t a s h e e t 11/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ typical performance curves - continued 0.0 0.5 1.0 1.5 2.0 2.5 0 1000 2000 3000 output current : i out [m a] frequency : f sw [mhz] 0.890 0.895 0.900 0.905 0.910 -40-20 0 20406080 temperature : ta [ ] output voltage : v out [v] 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0246810 output current : i out [a] output voltage : v out [v] 200 220 240 260 280 300 320 340 0 1000 2000 3000 output current : i out [m a] on time [nsec] v in =3.3v v out =0.9v/1a l =1h figure 27. output variation (ambient temperature) figure 28. ocp detection current v in =3.3v v out =0.9v l =1h figure 29. on time v.s. output current figure 30. frequency v.s. output current v in =3.3v v out =0.9v l=1h v in =3.3v v out =0.9v l=1h
datasheet d a t a s h e e t 12/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ application information operation BD9B331GWZ is a buck synchronous rect ification switching regulator capable of high speed transient response by implementing a constant on time system as its hysteresis control. general hysteres is control systems need a certain ripple to give an output voltage. furthermore, a high esr output capa citor is needed to maintain appropriate switching control. BD9B331GWZ has a ripple implanted syst em at output detection which keeps a no rmal switching operation even if a low esr output capacitor is used. this feature also resolved a weak ness of a regular hysteresis control, which is, to keep a steady frequency from a variation of frequencies. when operating with light loads, bd9b331g wz reduce switching loss and attain high efficiency by utilizing a pulse skip system. figure 31. constant on time system block diagram description of operations ? soft start function when en terminal is shifted to ?high?, it activates a soft-star t function which gradually raises the output voltage while limit ing the current at startup. th is prevents an overshoot in output voltage by preventin g startup in-rush current. if en terminal is shifted to ?high? when capacitor css is not connected, ss pin is open or in ?high? condition, the output voltage will rise in 1msec(typ). ? shutdown function with en terminal shifted to ?low?, the device turns to standb y mode. all functional blocks including reference voltage circuit, internal oscillator and drivers are turned off. circuit current during standby is 0 a (typ). [msec] [v] ] [ [sec] 0.01 c when ex) (typ) a 1.2 pin start - soft at current source is (typ) 0.6v voltage fb is pin start - soft to connected capacitor is time start - soft is : where ss 0 5 2 1 6 0 01 0 . = . / ) . . ( = [a] a f ? ? ? ? s s ss fb ss ss ss f b s s ss t i v c t i v c t
datasheet d a t a s h e e t 13/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ ? uvlo function uvlo detects whether the input voltage is sufficient to secure a desired ic output voltage. a hysteresis width of 50mv (typ) is provided to prevent output chattering. figure 32. soft start, shutdown, uvlo timing chart ? power-good function when fb terminal voltage falls below 80%(0.48v) of the intern al reference voltage, an open drain mos which is internally connected to pgd terminal turns on. this event pulls down the pgd terminal with a 100 ? (typ) impedance. when fb terminal voltage reaches 85%(0.51v) of the internal reference voltage, pgd terminal will enter a high impedance state after 15sec delay. this terminal is an open drain out put so a pull up resistor is needed for proper operation. figure 33. power-good timing chart hysteresis range 50mv tss tss tss soft start standby mode operation mode standby mode v in en v out standby mode standby mode operation mode operation mode
datasheet d a t a s h e e t 14/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ ? over current protection function(ocp) / pu lse count short-circuit protection (scp) over current detection circuit is operating when the high side mos is on. when over current is detected, on/off duty will be controlled to decrease the output voltage. if over current is still present 512 counts after output voltage falls below 80% of the set voltage (power good error), the output will be latched in off state to prevent ic damage. output is returned by resetting en or releasing uvlo again. figure 34. over current protection/short- circuit protection function timing chart ? over short reduction(load responsivenes s characteristic improvement function) output voltage rises when load current is decreased rapidly. normally, low side power mos is kept on turning on and the gradient of coil current i l will be i l = -vo/l. at this point, if slew rate, i out , of load current i out will be i out > i l , excess current will be charged and output voltage will keep on rising (fig.35 dotted line wave form). when the output voltage is set to a low value, i l will be small and output voltage will increase significantly. BD9B331GWZ operates over shoot reduction when the low side power mos is kept on after twic e the pwm pulse width. vf vo ltage is generated to the sw terminal by turning off the hg-lg and applying i l through the body diode of the low side mos. this makes i l =(-vf- v out )/l and reduces the rise in output voltage by controlli ng excess current not to be charged to output capacitor. figure 35. over short reduction timing chart i out i l -vf v out hg lg v in
datasheet d a t a s h e e t 15/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ switching regulator efficiency efficiency may be improved by reducing the swit ching regulator power dissipation factors p d as follows: dissipation factors: 1) on resistance dissipation of inductor and fet p d (i 2 r) 2) gate charge/discharge dissipation p d (gate) 3) switching dissipation p d (sw) 4) esr dissipation of capacitor p d (esr) 5) operating current dissipation of ic p d (ic) 1) 2) 3 4) 5) [%] [%] [%] 100 100 100 ? ? ? ? ? ? ? ? ? d out out in out in in out out p p p p p i v i v current output is fet of resistance on is inductor of resistance dc is : where out on coil on coi l out d i r r r r i p i ) ( ) r ( ? ? ? 2 2 fet of voltage driving gate is frequency switching is fet of e capacitanc gate is : where v f cqs v f cqs ) gate ( 2 ? ? ? d p gate of current peak is fet of e capacitanc transfer reverse is : where drive rss drive out rss in i c i f i c v ) sw ( ? ? ? ? 2 d p resistance series equivalent is capacitor of current ripple is : where esr i rms rms esr i ) esr ( ? ? 2 d p current circuit is : where cc cc in i i v ) ic ( ? ? d p
datasheet d a t a s h e e t 16/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ power dissipation (pd) as for power dissipation, an estimate of heat reduction characte ristics and internal power consumption of ic are shown, so please use these for reference. since power dissipation chang es substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure pd on a set board. exceeding the power dissipation of ic may lead to deterioration of the original ic performance, such as reduction in current capability. therefore, be sure to prep are sufficient margin within power dissipation for usage. measurement conditions evaluation board layout of board for measurement top layer (top view) bottom layer (bottom view) measurement state with board im plemented (wind speed 0 m/s) board material glass epoxy resin (9 layers) board size 63 mm x 55 mm x 1.6 mm wiring rate top layer metal (gnd) wiring rate: approx. 81.6% bottom layer metal (gnd) wi ring rate: approx. 82.3% copper foil thickness outer layer l1,l9 : 27 m inner layer l8 : 27 m,l2~l7 : 18 m through hole diameter 0.1mm x 256 holes diameter 0.6mm x 266 holes power dissipation 0.81w thermal resistance ja =153.8c/w thermal design must be carried out with sufficient margin allowed with consideration on the dissipation above. figure 36. power dissipation (BD9B331GWZ) 0 25 50 75 100 125 150 0 0.4 0.6 0.8 0.81w power dissipation: pd [w] 0.2 85 ambient temperature :ta [c] [w] ] [ ? 3a i , 23m ? r , 23m ? r 1v, v 5v, v ex) current output is fet mos side low of resistance on is fet mos side high of resistance on is ) /v v ( duty on is : where out onl onh out in in out 207 0 023 0 3 023 0 023 0 2 0 1 023 0 2 0 2 0 5 1 1 2 2 . . . . ) . ( . . = . = d d ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? p r v v d r r r r i p on in out out onl onh onl onh on o n ou t i r r d
datasheet d a t a s h e e t 17/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ external component selection 1. inductor (l) current flow that exceeds the coil rating brings the coil into magnetic saturation, which may lead to lower efficiency. select an inductor with an adequate margin so that the peak current does not exceed the rated current of the coil. in addition, select a coil with a low resistance component (dcr , acr) to lessen coil dissipation and improve efficiency. 2. output capacitor (c out ) the inductance has great influenc e on the output ripple current. a s seen in the equation (1), the ripple current decreases as the inductor and/or switching frequency increases. efficiency is affected as the dissipation factor, p d (i 2 r), p d (gate), p d (sw), changes with respect to the coil value and pfm frequency dependence on ripple current. BD9B331GWZ is designed to have least dissipation in pfm and pwm, both about l = 0.47h to 1h. output capacitor should be selected with the consideration on the stability region and the equivalent series resistance required for smooth ripple voltage. output ripple voltage is determined by the equation (2) the capacitor rating must allow a sufficient margin with respect to the output voltage. a 22 f to 100 f ceramic capacitor is recommended. a capacitor with low esr is recommended order to reduce output ripple. maximum value of c out must be considered as a large current is needed to charge c out to v out set point during boot-up. this current may trigger ove r current protection (ocp) and c ause a normal boot-up failure. figure 38. output capacitor figure 37. output ripple current ? ?? current ripple output is frequency switching is : where (1) a l in ou t ou t i n l i f f v l v v v i ? - ? ? current ripple output is cout of resistance series equivalent is : where (2) v es r i v l l ou t i esr ? 6.5a about min) detection( current over is page12) to (refer time start soft is : where (3) ocp ss out ocp ss out t v i t c i ? [f] ?
datasheet d a t a s h e e t 18/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ 3. input capacitor (c in ) i rms(max) ex) BD9B331GWZ when v in =5.5v, v out =2.75v, i outmax =3a 4. feedback capacitor generally, in fixed on time control (hysteresis control), sufficient ripple voltage in fb voltage is needed to operate comparator stably. this ic is designed to respond to low esr output capacitor, such as cera mic capacitor, by injecting a ripple to the feedback voltage. in order to inject appropriate ripple, a feedback capacitor of 100pf to 200pf is recommended. 5. output voltage determination the output voltage v out is determined by the equation (5): with r1 and r2 adjusted, the output vo ltage may be determined as required. output voltage setting range is 0.6v to pvcc 0.8 v 6. bootstrap capacitor bootstrap capacitor c boot shall be 0.1 f. connect a bootstrap capacitor between sw pin and boot pin. for capacitance of bootstrap capacitor, take temperature characte ristics, dc bias characteristi cs, etc. into consideration to set minimum value to no less than 0.047 f. input capacitor must be a low esr capacitor with a capacitance sufficient to cope with high ripple current to prevent high transient voltage. the ripple current i rms is given by the equation (4): figure 39. input capacitor use about 100k ? resistor for r1 and r2 to consider loss at the pfm. figure 40. output voltage setting resisto r v in l c out v out c in sw fb l c out r2 r1 v out ? ? (4) ? [a] in out in out out rms v v v v i i ? ? ? ? typ.) 6v voltage(0. terminal fb is : where f b v fb out v v (5) 1 1 2 ? ? ? ? ? ? ? ? ? ? ? r r 2 , 2 = out rms out in i = i v v ? ? ? ] [a rms 5 . 1 5 . 5 75 . 2 5 . 5 75 . 2 3 ? ? ? ? ? rms i
datasheet d a t a s h e e t 19/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ recommended part circuit recommendation parts list (note 4) for capacitance of input capacitor, take temperature c haracteristics, dc bias characteristics, etc. into consideration to set minimum value to no less than 8 f. evaluation using the actual machine must be done for abov e constant is only a value on our evaluation board. part no value manufacturer part number size(mm) u1 - rohm BD9B331GWZ 1.98*1.80*0.33 l1 1.0h toko dfe252010f-1r0m 2520 c1 22f (note 4) murata grm219 series 10v 2012 c2 - - - - c3 22f murata grm188 series 4v 1608 c4 - - - - c5 100pf murata grm033 series 0603 c6 0.1uf murata grm033 series 0603 c7 1000pf rohm mcr006 series 0603 c8 - - - - r1 100k ? rohm mcr006 series 0603 r2 200k ? rohm mcr006 series 0603 r3 100 ? rohm mcr006 series 0603 r4 100k ? rohm mcr006 series 0603 en provide control signal externally when controlling the output via enable terminal. res connect to ground. r4 pull-up resistor for power good function. keep pgd open or connect it to ground when power good function is not in use. figure 41. recommended part circuit pvcc avcc en ss pgnd agnd fb sw bst pgd v in v out 0 . 9 v l 1 c 1 c 3 c 5 r 1 r 2 c 6 res c 7 r 3 u 1 c 4 r 4 power good c 2 c 8
datasheet d a t a s h e e t 20/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ pcb layout design in the step-down dc/dc converter, a large pul se current flows into two loops. the firs t loop is the one into which the current flows when the high-side fet is turned on. the flow starts from the input capacitor c in , runs through the fet, inductor l and output capacitor c out and back to gnd of c in via gnd of c out . the second loop is the one into which the current flows when the low-side fet is turned on. the flow starts from the low-side fet, runs through the inductor l and output capacitor c out and back to gnd of the low-side fet via gnd of c out . route these two loops as thick and as short as possible to allow noise to be reduced for improved efficiency. it is recommended to connect the input and output capacitors directly to the gnd plane. the pcb la yout has a great influence on the dc/dc c onverter in terms of all of the heat generation, noise and efficiency characteristics. accordingly, design the pcb layout considering the following points. ? connect an input capacitor as close as possible to the ic pv cc terminal on the same plane as the ic. ? if there is any unused area on the pcb, provide a copper fo il plane for the gnd node to assist heat dissipation from the ic and the surrounding components. ? switching nodes such as sw are susceptible to noise due to ac coupling with other nodes. route the coil pattern as thick and as short as possible. ? provide lines connected to fb far from the sw nodes. ? place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. figure 42. current loop of buck converter
datasheet d a t a s h e e t 21/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ an example of pcb layout figure 43. an example of pcb layout parts placement top layer middle layer bottom layer BD9B331GWZ
datasheet d a t a s h e e t 22/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ i/o equivalent circuit(s) figure 44. i/o equivalence circuit ? en pin ? sw pin pvcc sw a vcc ? ss pin ss pgd ? pgd pin en 0.5m ? 0.9m ? 0.3m ? ? fb pin fb pvcc bst ? bst pin pvcc sw pvcc pvcc
datasheet d a t a s h e e t 23/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider t he effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this abs olute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guarante ed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet d a t a s h e e t 24/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ operational notes ? continued 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transis tor. the gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the outsi de can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction thr ough the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 45. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circ uit that will turn off all output pins. the ic should be powered down and turned on again to resume normal operation becau se the tsd circuit keeps t he outputs at the off state even if the tj falls below the tsd threshold. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characteriz ed by continuous operation or transit ioning of the protection circuit. 17. disturbance light in a device where a portion of silicon is exposed to light su ch as in a wl-csp, ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light.
datasheet d a t a s h e e t 25/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ ordering information b d 9 b 3 3 1 g w z - e2 part number package gwz:ucsp30l1 packaging and forming specification e2: embossed tape and reel marking diagrams ucsp30l1 (top view) b 33 1 part number marking lot numbe r 1pin mark
datasheet d a t a s h e e t 26/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ physical dimension, tape and reel information package name ucsp30l1 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin
datasheet d a t a s h e e t 27/27 tsz02201-0j3j0aj00810-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD9B331GWZ revision history date revision changes 28.jun.2015 001 new release 27.may.2015 002 error correction
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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